Scope and Topics
Scope:
The Conference provides an opportunity for the presentation of latest advances in modeling and simulation of semiconductor devices, processes and circuits. Special emphasis is placed on practical applications.
Topics:
- Back-end modeling and simulation including equipment optimization
- Process modeling and simulation based on macroscopic as well as atomistic approaches
- Optimization methods for process variation
- All sorts of advanced device simulations including comparison with real world
- Compact modeling for advanced devices and parameter extraction methods
- Interconnect modeling including high frequency applications
- Reliability modeling for fabrication processes
- Advanced numerical methods and algorithms
- Methods for characterizing properties of advanced materials